Close Menu
    Login
    • Register
    • Log in
    • Entries feed
    • Comments feed
    • WordPress.org
    • Home
    • Technology
    • Daily Tech
      • Science and Technology
    • Gadgets
    • Gaming
    • Space Exploration
    • Scope
    • Tech News
    Facebook X (Twitter) Instagram Pinterest YouTube WhatsApp
    Facebook X (Twitter) Instagram
    NewTechMania | Tech Revolution Mastering The InsightsNewTechMania | Tech Revolution Mastering The Insights
    Login
    • Home
    • Blog
    • Gadgets
      • Gaming
    • Technology
      • Science
    • Automobile
    • Exploration
    • Scope
    • Tech News
    NewTechMania | Tech Revolution Mastering The InsightsNewTechMania | Tech Revolution Mastering The Insights
    You are at:Home»Technology»Intel Launches New Mexico Advanced Packaging Facility – technology
    Technology

    Intel Launches New Mexico Advanced Packaging Facility – technology

    By Karan sharma26 January 2024No Comments3 Mins Read
    Facebook Twitter Pinterest LinkedIn Tumblr Email
    Photo by Slejven Djurakovic
    Photo by Slejven Djurakovic
    Share
    Facebook Twitter LinkedIn Pinterest Email

    In 2021, the corporation initially declared that it would be expanding into New Mexico.

    At this very moment, Intel is celebrating the opening of a brand new facility in New Mexico that is known as Fab 9. Two years ago, the corporation made the announcement that the project would cost $3.5 billion, and now it is fully open for business. The facility is designed to meet the most advanced packaging requirements of Intel, including the company’s Foveros technology, which is a three-dimensional chip stacking technology. It will be combined with the existing Fab 11X that the corporation has in order to increase the amount of sophisticated packaging that Intel produces.

    In Rio Rancho, New Mexico, which is a suburb of Albuquerque, the new facility has been constructed. According to the firm, the new unit is the only factory in the United States that is capable of generating innovative packaging on a large scale. Plans for the New Mexico facility were initially revealed in May 2021, immediately following the reinstatement of CEO Pat Gelsinger to the leadership of the firm and the transition to the IDM 2.0 strategy of “five nodes in four years.” For that to be possible, it would require certain technologies to be operational in the future, and as a result, we are currently in this position.

    According to Intel, the new fabrication facility is devoted to Foveros and EMIB, which are packaging technologies that are utilized on the company’s most cutting-edge tile-based (or chiplet) designs. The company’s “Meteor Lake” Core Ultra mobile chips, which make use of Foveros for three-dimensional stacking, and EMIB (Embedded multi-die interconnect bridge), which joins chiplets that are stacked next to one another on a two-dimensional substrate, are current examples of this. Ponte Vecchio, the company’s most advanced graphics processing unit (GPU) for data centers, utilizes both technologies. Intel has stated that the fab will be generating Foveros designs for its own requirements; nonetheless, this is not only a significant accomplishment for the company’s foundry service, but it will also strengthen the company’s resilience to worldwide disruptions such as the one that occurred with COVID-19.

    Rio Rancho has been home to Intel’s Fab 11X for many years, and the company’s Fab 9 is located in the same building. In the previous year, Intel made the announcement that it would be receiving a fresh coat of paint. At the same time, the business decreased its manufacturing of 11X from 90nm to 45nm by more than one billion dollars. Over the course of the year, Intel has made significant investments in both of these locations as part of its efforts to strengthen its fabrication capabilities in order to aggressively compete with TSMC. It is not a coincidence that TSMC has announced its own investment of $2.9 billion to expand its capabilities in advanced packaging.

    Share. Facebook Twitter Pinterest LinkedIn Tumblr Email
    Previous ArticleIt is anticipated that Apple will be first in line for TSMC’s 2nm chips – technology
    Next Article The New Startup of the Former CEO of Google Will Produce AI Attack Drones – technology

    Related Posts

    Skypeaklimits 2024: Your Digital Success Elevate Your Presence

    OpenAI partners with Palmer Luckey’s Anduril to build military AI

    MS assures Windows 11 TPM security requirement won’t change

    Peloton launches audio-focused strength training app

    Add A Comment

    Comments are closed.

    NewTechMania Tech Revolution Mastering Insights Embark on a tech adventure with latest gadgets technologies join us exploring possibilities main logo

    About US

    Embark on a tech adventure with NewTechMania. From the latest gadgets to emerging technologies, join us in exploring the possibilities that lie ahead.

    Terms

    • Privacy
    • Cookie
    • Terms
    • Disclaimer
    • DMCA

    Useful Links

    • Home
    • About Us
    • Contact Us
    • Get In Touch
    • Privacy

    Weekly Newslatter

    Subscribe to our newsletter to get updated!
    © 2025 NewTechMania. All RightS Reserved.
    Facebook-f Twitter Instagram Pinterest Youtube

    Type above and press Enter to search. Press Esc to cancel.

    Sign In or Register

    Welcome Back!

    Login below or Register Now.

    Lost password?
    Continue with Google

    Register Now!

    Already registered? Login.

    A password will be e-mailed to you.

    Continue with Google